FU-F1140
1U Rackmount Fanless Chassis for Mini-ITX
· Silent, dust-free & energy-efficient operation
· Extensive aluminum-made heatsink(for CPU: TDP 35W)
· Innovative thermal cooling: Combination of thermal pads and copper thermal blocks
· Support 2.5" hot swap tray(full height) x4 on front panel
· Support expansion slot x1
· Silent, dust-free & energy-efficient operation
· Extensive aluminum-made heatsink(for CPU: TDP 35W)
· Innovative thermal cooling: Combination of thermal pads and copper thermal blocks
· Support 2.5" hot swap tray(full height) x4 on front panel
· Support expansion slot x1
Specification
| Front Panel | |
| Power Switch | 1 |
| LED Indicators | Power x1, HDD x1 |
| USB 2.0 Port | 2 |
| HDD/SSD # and type | 2.5'' Hot Swap Tray x4 |
| Back Panel | |
| Expansion Slot | 1 |
| Internal Structure | |
| Heat-transfer Device | Aluminum Block and Heat Pipe |
| Mechanical & Processing | |
| Dimensions | W:19.0"(482.0mm) x D:15.0"(381.0mm) x H:1.73"(44.0mm) |
| Applied M/B Form Factor | Mini-ITX |
| Material | SGCC |
| Surface | Black Wet Paint with Texture Coat |
| Colour | Black / Customizable Colour |
| Power Solution Option | |
| Flex ATX Power Supply | |
Add to cart
FU-F1140
1U Rackmount Fanless Chassis for Mini-ITX
· Silent, dust-free & energy-efficient operation
· Extensive aluminum-made heatsink(for CPU: TDP 35W)
· Innovative thermal cooling: Combination of thermal pads and copper thermal blocks
· Support 2.5" hot swap tray(full height) x4 on front panel
· Support expansion slot x1
· Silent, dust-free & energy-efficient operation
· Extensive aluminum-made heatsink(for CPU: TDP 35W)
· Innovative thermal cooling: Combination of thermal pads and copper thermal blocks
· Support 2.5" hot swap tray(full height) x4 on front panel
· Support expansion slot x1