UNI-W700
Water-proof fanless chassis for Mini-ITX
· IP67 chassis
· Support 2.5" HDD x1
· Custom I/O shield design based on MB
· Custom front/back panel design
· Innovative thermal cooling: Combination of thermal pads and copper thermal blocks
· Enhanced thermal solution: Extensive aluminum-made heatsink(top cover)
· IP67 chassis
· Support 2.5" HDD x1
· Custom I/O shield design based on MB
· Custom front/back panel design
· Innovative thermal cooling: Combination of thermal pads and copper thermal blocks
· Enhanced thermal solution: Extensive aluminum-made heatsink(top cover)
Specification
| Front Panel | |
| Power Switch | 1 |
| Back Panel | |
| USB 3.0 | 2 |
| 3 Pin Power Connector | 2 |
| HDMI | 1 |
| LAN | 1 |
| Internal Structure | |
| System Cooling |
1. Thermal Pads / Copper Thermal Block Combination: Which are positioned on the rear-side of the top cover to transfer heat from CPU and chipset (North bridge and South bridge) to top cover. 2. Aluminum-made Heat Sink Top Cover: With extensive heat sink surface from top cover of the chassis, Kiwatek's fanless chassis provide excellent heat dissipation to eliminate the heat and solve thermal issues. |
| Copper thermal block | Positioned on the Back Side of Top Cover |
| Memory Height | Accept Standard Size |
| HDD/SSD # and type | 2.5" HDD x1 |
| Mechanical & Processing | |
| Dimensions | W:8.9"(227mm) x D:10.3"(261.55mm) x H:4.1"(105.3mm) |
| Applied M/B Form Factor | Mini-ITX |
| Material | SGCC |
| Surface | Black Wet Paint with Texture Coat |
| Colour | Black / Customizable Colour |
| Power Solution Option 1 | |
| Internal DC Power Board | C4(150W, 19V~24V) DC Power Board |
| External AC Adapter | 90W: Input(AC 100~240V); Output(DC 19V@4.74A) |
| Power Solution Option 2 | |
| Internal DC Power Board | C4(150W, 19V~24V) DC Power Board |
| External AC Adapter | 120W: Input(AC 100~240V); Output(DC 19V@6.32A) |
Add to cart
UNI-W700
Water-proof fanless chassis for Mini-ITX
· IP67 chassis
· Support 2.5" HDD x1
· Custom I/O shield design based on MB
· Custom front/back panel design
· Innovative thermal cooling: Combination of thermal pads and copper thermal blocks
· Enhanced thermal solution: Extensive aluminum-made heatsink(top cover)
· IP67 chassis
· Support 2.5" HDD x1
· Custom I/O shield design based on MB
· Custom front/back panel design
· Innovative thermal cooling: Combination of thermal pads and copper thermal blocks
· Enhanced thermal solution: Extensive aluminum-made heatsink(top cover)