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ONDO-F230

Fanless Chassis for 3.5 Inch MB with CPU TDP 15W

· Custom I/O shield design based on MB
· Custom front/rear panel design
· Simple assembling and easy system integration
· Silent, dust-free & energy-efficient operation


ONDO-F230-DM ONDO-F230-Dimension Quote or Request

Specification

Front Panel
Power Switch 1(With LED Indicator)
LED Indicators HDD x1
USB Port 2
Back Panel
USB Port 3.0 2
GPIO 1
COM 4
HDMI 1
ANT 2
Gigabit LAN 2
VGA 1
Audio In/Out 1
Internal Structure 
System Cooling

Thermal Pads/Copper Thermal Block Combination:
Which are positioned on the back-side of the top cover to transfer heat from CPU and chipset(North bridge and South bridge) to top cover.

Aluminum-made Heat Sink Top Cover:
With extensive heat sink surface from top cover to two sides of the chassis, Kiwatek's fanless chassis provide excellent heat dissipation to eliminate the heat and solve thermal issues.
Copper Thermal Block Positioned on the Back Side of Top Cover
Memory height Accept standard size
HDD/SSD # and type Options           2.5" x1
Mechanical & Processing
Dimensions W:7.4"(189.0 mm) x D:5.8"(147.4 mm) x H:2.7"(68.5 mm)
Applied M/B Form Factor  3.5 inch Embedded Board
Material Zine-Fe Alloy Sheet
Surface Black Wet Paint with Texture Coat
Colour Black / Customizable Colour
Power Solution Option 
External AC Adapter 60W: Input(AC 100~240V); Output(DC 12V@5A)

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ONDO-F230
Fanless Chassis for 3.5 Inch MB with CPU TDP 15W

· Custom I/O shield design based on MB
· Custom front/rear panel design
· Simple assembling and easy system integration
· Silent, dust-free & energy-efficient operation

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