ONDO-F331-04  |Products|Fanless Enclosure|3.5'' Board

ONDO-F331-04


Fanless Chassis for 3.5 Inch MB with CPU TDP 25W

· Support 1 x 2.5" SATA tray · Simple assembling and easy system integration
· Silent, dust-free & energy-efficient operation



Specification

Front Panel
Power Switch 1(With LED Indicator)
LED Indicators HDD x1
USB Port 2
HDD/SSD # and type Options           2.5" x1
Back Panel
USB 3.0 Port 2
GPIO 1
COM 4
HDMI 1
ANT 2
Gigabit LAN 2
VGA 1
Audio In/Out 1
Internal Structure 
System Cooling

1. Thermal Pads/Copper Thermal Block Combination:

Which are positioned on the back-side of the top cover to transfer heat from CPU and chipset to top cover.

2. Aluminum-made Heat Sink Top Cover:

With extensive heat sink surface from top cover of the chassis, KiwaTEK's fanless chassis provide excellent heat dissipation to eliminate the heat and solve thermal issues.

Copper Thermal Block Positioned on the Back Side of Top Cover
Memory height Accept standard size
Mechanical & Processing
Dimensions W:7.43"(188.8 mm) x D:6.61"(168 mm) x H:2.17"(55.0 mm)
Applied M/B Form Factor  3.5 inch Embedded Board
Material SGCC
Surface Black Wet Paint with Texture Coat
Colour Black / Customizable Colour
Power Solution Option 
External AC Adapter 60W: Input(AC 100~240V); Output(DC 12V@5A)



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ONDO-F331-04

Fanless Chassis for 3.5 Inch MB with CPU TDP 25W

· Support 1 x 2.5" SATA tray · Simple assembling and easy system integration
· Silent, dust-free & energy-efficient operation